Pd etch mask for copper circuitization

Details Pd etch mask for copper circuitization Pd etch mask for copper circuitization

1998-03-04

2000-12-19

Bell, Mark L.

Etching a substrate: processes

Forming or treating electrical conductor article

216 17, 216 18, 216 19, 216 20, 29852, 430314, 430318, 205125, 205126, 427 98, 427105, H01B 1300, H01K 310, G03C 500, C25D 502, B05D 512

Patent

active

061623652

ABSTRACT:
A process for making a printed circuit board is provided. The process employs a noble metal as an etch mask for subtractive circuitization and as a seed layer for secondary finishing. In a preferred embodiment of the invention, a dielectric is covered by a conductive layer of metal such as copper, a patterned photoresist is applied, additional copper is deposited on areas not covered by the photoresist, and a palladium etch mask/seed layer is deposited on the copper. The palladium layer remains sufficiently active for deposition of nickel or gold on the circuitry for purposes such as wire bonding.

REFERENCES:
patent: 3006819 (1961-10-01), Wilson et al.
patent: 3013956 (1961-12-01), Hugle et al.
patent: 3075866 (1963-01-01), Baker et al.
patent: 3115423 (1963-12-01), Ashworth
patent: 3152938 (1964-10-01), Osifchin et al.
patent: 3240684 (1966-03-01), Martin et al.
patent: 3269861 (1966-08-01), Schneble, Jr. et al.
patent: 3287191 (1966-11-01), Borth
patent: 3297442 (1967-01-01), Spiers
patent: 3483615 (1969-12-01), Gottfried
patent: 3522085 (1970-07-01), Watanabe
patent: 3666549 (1972-05-01), Rhodenizer et al.
patent: 3791858 (1974-02-01), McPherson et al.
patent: 3991231 (1976-11-01), Trausch
patent: 4024631 (1977-05-01), Castillero
patent: 4076575 (1978-02-01), Chang
patent: 4144118 (1979-03-01), Stahl
patent: 4211603 (1980-07-01), Reed
patent: 4224361 (1980-09-01), Romankiw
patent: 4306925 (1981-12-01), Lebow et al.
patent: 4316779 (1982-02-01), Yahalom
patent: 4325780 (1982-04-01), Schulz, Sr.
patent: 4440823 (1984-04-01), Hoffmann
patent: 4444619 (1984-04-01), O'Hara
patent: 4525390 (1985-06-01), Alpaugh et al.
patent: 4528064 (1985-07-01), Ohsawa et al.
patent: 4755265 (1988-07-01), Young
patent: 4933045 (1990-06-01), DiStefano et al.
patent: 4946563 (1990-08-01), Yeatts
patent: 5017271 (1991-05-01), Whewell et al.
patent: 5139823 (1992-08-01), Toba et al.
patent: 5158860 (1992-10-01), Gulla et al.
patent: 5167992 (1992-12-01), Lin et al.
patent: 5268260 (1993-12-01), Bantu et al.
patent: 5309632 (1994-05-01), Takahashi et al.
patent: 5376248 (1994-12-01), Conrod et al.
patent: 5415762 (1995-05-01), Allardyce et al.
patent: 5443865 (1995-08-01), Tisdale et al.
patent: 5457881 (1995-10-01), Schmidt
patent: 5526564 (1996-06-01), Oshima et al.
patent: 5665525 (1997-09-01), Pienimaa
patent: 5666722 (1997-09-01), Tamm et al.
patent: 5758412 (1998-06-01), Knopp
patent: 5761802 (1998-06-01), Grigas
patent: 5799393 (1998-09-01), Backasch et al.
patent: 5863405 (1999-01-01), Miyashita

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