Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate
2011-04-26
2011-04-26
Hoang, Quoc D (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With semiconductor element forming part
C438S125000, C257SE23063, C257SE21053
Reexamination Certificate
active
07932589
ABSTRACT:
A semiconductor device capable of wireless communication, which has high reliability in terms of resistance to external force, in particular, pressing force and can prevent electrostatic discharge in an integrated circuit without preventing reception of an electric wave. The semiconductor device includes an on-chip antenna connected to the integrated circuit and a booster antenna which transmits a signal or power included in a received electric wave to the on-chip antenna without contact. In the semiconductor device, the integrated circuit and the on-chip antenna are interposed between a pair of structure bodies formed by impregnating a fiber body with a resin. One of the structure bodies is provided between the on-chip antenna and the booster antenna. A conductive film having a surface resistance value of approximately 106to 1014Ω/cm2is formed on at least one surface of each structure body.
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Search Report (Application No. 08012865.5) dated Nov. 27, 2008.
Horikoshi Nozomi
Kato Kiyoshi
Koen Takaaki
Koyama Jun
Ohtani Hisashi
Hoang Quoc D
Robinson Eric J.
Robinson Intellectual Property Law Office P.C.
Semiconductor Energy Laboratory Co,. Ltd.
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