Method for fabricating a clamping device for flexible substrate

Details Method for fabricating a clamping device for flexible substrate Method for fabricating a clamping device for flexible substrate

2011-04-19

2011-04-19

Trinh, Minh (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S592100, C029S884000, C029S876000, C269S050000, C269S310000

Reexamination Certificate

active

07926170

ABSTRACT:
A method of fabricating a clamping device for a flexible substrate is provided. A carrier board having a first positing holes and a plurality of second position holes is provided, wherein the first and the second position holes correspond in position to a plurality of through holes on the flexible substrate. A portion of the carrier board material close to the second position holes is removed to form a hole body and a plurality of curved extending arms connected to the hole body and the carrier board. A first dowel pin and a plurality of second dowel pins are provided for inserting into the first positioning hole and the second positioning holes, respectively.

REFERENCES:
patent: 2355643 (1944-08-01), Grover
patent: 6695298 (2004-02-01), Hertz et al.
patent: 7591066 (2009-09-01), Wu et al.
patent: 7793900 (2010-09-01), Feng et al.

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