Semiconductor device and optical pickup device

Details Semiconductor device and optical pickup device Semiconductor device and optical pickup device

2011-06-14

2011-06-14

Agustin, Peter Vincent (Department: 2627)

Dynamic information storage or retrieval

Specific detail of information handling portion of system

Radiation beam modification of or by storage medium

C369S120000

Reexamination Certificate

active

07961585

ABSTRACT:
By increasing the width of a lead terminal2connected to a die pad1in the vicinity of the die pad1and forming a slit9and a projecting plate in the lead terminal in the region where resin5is formed, it is possible to ensure the holding strength of the lead terminal by the resin5, as well as ensuring the strength of the lead terminal during the manufacturing process and achieving a reduction in thickness.

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