Method of fabricating printhead assembly

Details Method of fabricating printhead assembly Method of fabricating printhead assembly

2011-05-03

2011-05-03

Aftergut, Jeff H (Department: 1746)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C216S027000, C029S603070

Reexamination Certificate

active

07935204

ABSTRACT:
A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.

REFERENCES:
patent: 6312114 (2001-11-01), Silverbrook
patent: 2002/0024569 (2002-02-01), Silverbrook
patent: 2006/0207720 (2006-09-01), Yoshizawa et al.
patent: 1352744 (2003-10-01), None

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