Substrate plating method and apparatus

Details Substrate plating method and apparatus Substrate plating method and apparatus

2011-04-05

2011-04-05

Van, Luan V (Department: 1724)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C205S220000

Reexamination Certificate

active

07918983

ABSTRACT:
A substrate plating method makes it possible to plate a metal, such as copper or a copper alloy, uniformly into fine recesses in a substrate without forming voids in the metal-filled recesses. The substrate plating method for filling a metal into fine recesses in a surface to be plated of a substrate includes carrying out first plating on the surface to be plated in a plating solution containing a plating accelerator as an additive, carrying out plating accelerator removal processing by bringing a remover, having the property of removing or decreasing the plating accelerator adsorbed on the plating surface, into contact with the plating surface, and then carrying out second plating on the plating surface at a constant electric potential.

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patent: 2002/0175080 (2002-11-01), Teerlinck et al.
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patent: 2003-328180 (2003-11-01), None
patent: 2006-274369 (2006-10-01), None
patent: 2006-307279 (2006-11-01), None

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