Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2011-08-23
2011-08-23
Fahmy, Wael M (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257SE23142, C257SE21585, C257S678000, C257S733000, C257S796000, C257SE23001, C257SE23194, C257S680000, C257S686000, C257S725000, C257S790000, C438S637000
Reexamination Certificate
active
08004089
ABSTRACT:
On the lower surface of a semiconductor construct having an external connection electrode, there are formed an insulating film having a planar size greater than that of the semiconductor construct, and a metal layer and a mask metal layer having a connection pad portion in which a first opening corresponding to the external connection electrode is formed. A laser beam is applied using the mask metal layer as a mask, and a second opening is thereby formed in a part of the insulating film corresponding to the external connection electrode. Then, a connection conductor is formed to connect a wiring line to the external connection electrode via the second opening of the insulating film.
REFERENCES:
patent: 5111278 (1992-05-01), Eichelberger
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5527741 (1996-06-01), Cole et al.
patent: 5703400 (1997-12-01), Wojnarowski et al.
patent: 5821626 (1998-10-01), Ouchi et al.
patent: 6154366 (2000-11-01), Ma et al.
patent: 6271469 (2001-08-01), Ma et al.
patent: 6590291 (2003-07-01), Akagawa
patent: 6696764 (2004-02-01), Honda
patent: 7183639 (2007-02-01), Mihara et al.
patent: 7358114 (2008-04-01), Ooi et al.
patent: 7445964 (2008-11-01), Mihara et al.
patent: 2002/0182770 (2002-12-01), Chen et al.
patent: 2003/0137057 (2003-07-01), Honda
patent: 2004/0051169 (2004-03-01), Chen et al.
patent: 2004/0245614 (2004-12-01), Jobetto
patent: 2007/0138619 (2007-06-01), Shinagawa et al.
patent: 2009/0194866 (2009-08-01), Jobetto
patent: 1723556 (2006-01-01), None
patent: 1830081 (2006-09-01), None
patent: 9-321408 (1997-12-01), None
patent: 2001-217337 (2001-08-01), None
patent: 2003-017854 (2003-01-01), None
patent: 2003-188314 (2003-07-01), None
patent: 2004-71998 (2004-03-01), None
patent: 2004-87661 (2004-03-01), None
patent: 2005-16302 (2005-02-01), None
patent: WO 2004/064153 (2004-07-01), None
Japanese Office Action dated Jan. 12, 2010 and English translation thereof issued in a counterpart Japanese Application No. 2008-020692.
Chinese Office Action dated Jan. 29, 2010 and English translation thereof in Chinese Application No. 2009100098367, which is a counterpart of related U.S. Appl. No. 12/359,427.
Related U.S. Appl. No. 12/359,427, filed Jan. 26, 2009.
Chinese Office Action dated Feb. 26, 2010 and English translation thereof in counterpart Chinese Application No. 200910009626.8.
Armand Marc
Casio Computer Co. Ltd.
Fahmy Wael M
Holtz Holtz Goodman & Chick PC
LandOfFree
Semiconductor device having wiring line and manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device having wiring line and manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having wiring line and manufacturing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2679528