Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal or alloy coating on...
Reexamination Certificate
2011-03-22
2011-03-22
Van, Luan V (Department: 1724)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Depositing predominantly single metal or alloy coating on...
C205S118000
Reexamination Certificate
active
07909976
ABSTRACT:
It is characterized in that in the case of filling a through hole formed in a substrate with a plated metal by electrolytic plating, the electrolytic plating is started by a high current density higher than Constant Current Density capable of fully filling the through hole when the electrolytic plating is performed with a current density held constant as a current density of the electrolytic plating, and the electrolytic plating is continued by being changed to a current density lower than the high current density by the time of reaching formation of a seam diameter in which an inside diameter does not decrease even when the electrolytic plating is continued after the electrolytic plating at the high current density is started.
REFERENCES:
patent: 4534832 (1985-08-01), Doiron, Jr.
patent: 4666567 (1987-05-01), Loch
patent: 5656139 (1997-08-01), Carey et al.
patent: 6261433 (2001-07-01), Landau
patent: 6297155 (2001-10-01), Simpson et al.
patent: 6451195 (2002-09-01), Watanabe
patent: 6458696 (2002-10-01), Gross
patent: 6793796 (2004-09-01), Reid et al.
patent: 2004/0045832 (2004-03-01), Martyak
patent: 2005/0051436 (2005-03-01), Chen et al.
patent: 62077494 (1987-04-01), None
patent: 4147694 (1992-05-01), None
patent: 5331697 (1993-12-01), None
patent: 2003253490 (2003-09-01), None
patent: 2005093934 (2005-04-01), None
patent: WO 03/033775 (2003-04-01), None
Lowenheim (Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 12-13).
Drinker Biddle & Reath LLP
Shinko Electric Industries Co. Ltd.
Van Luan V
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