Reduction of attraction forces between silicon wafers

Details Reduction of attraction forces between silicon wafers Reduction of attraction forces between silicon wafers

2011-06-28

2011-06-28

Kornakov, Michael (Department: 1714)

Cleaning and liquid contact with solids

Processes

Using solid work treating agents

C438S458000

Reexamination Certificate

active

07967915

ABSTRACT:
A method for reducing attraction forces between wafers (4) is provided. This method includes the step of, after sawing and before dissolution of the adhesive (5), introducing spacers (6) between wafers (4). A wafer singulation method and an agent for use in the method are also provided.

REFERENCES:
patent: 5213451 (1993-05-01), Frank et al.
patent: 6210795 (2001-04-01), Nelson et al.
patent: 6420211 (2002-07-01), Brunet et al.
patent: 1333919 (2002-01-01), None
patent: 102 20 468 (2003-11-01), None
patent: 2002-036090 (2002-06-01), None

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