Integrated circuit packaging system with layered packaging...

Details Integrated circuit packaging system with layered packaging... Integrated circuit packaging system with layered packaging...

2011-01-04

2011-01-04

Chambliss, Alonzo (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S127000, C257S686000, C257S724000, C257S780000, C257S787000, C257SE21614, C361S790000, C361S792000

Reexamination Certificate

active

07863100

ABSTRACT:
A method of manufacture of an integrated circuit packaging system includes: forming a base package having a base interposer; forming an intermediate package having an intermediate interposer and an intermediate package embedded link trace, the intermediate package embedded link trace being encapsulated in an intermediate package mold compound; forming a cap package having a cap interposer; and connecting the intermediate package to the cap package and the base package using the intermediate package embedded link trace.

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