Semiconductor device

Details Semiconductor device Semiconductor device

2011-07-12

2011-07-12

Stark, Jarrett J (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257SE23149, C257SE21476, C438S601000

Reexamination Certificate

active

07977764

ABSTRACT:
A semiconductor device that includes a metal fuse which may be used for redundancy or trimming, allowing for adjustment in the characteristics of a circuit. The fuse includes a disconnecting metal, a plurality of metal-vias that are connected under respective ends of the disconnecting metal, and a plurality of interconnections that connect to the disconnecting metal through respective metal-vias. The disconnecting metal is disconnected by a laser exposure and the metal-vias are located inside of the spot diameter of the laser used for the laser exposure, and are spaced apart from a side surface of the disconnecting metal. The disconnecting metal is formed of a material having a melting point and a boiling point that is lower than the melting point and boiling point of the metal-vias.

REFERENCES:
patent: 6163062 (2000-12-01), Shiratake et al.
patent: 05-074947 (1993-03-01), None
patent: 11-135631 (1999-05-01), None
patent: 2000-286341 (2000-10-01), None

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