Curable silicone composition and electronic component

Details Curable silicone composition and electronic component Curable silicone composition and electronic component

2011-08-09

2011-08-09

Sanders, Kriellion A (Department: 1761)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C524S714000, C524S731000, C524S751000, C524S863000, C524S864000

Reexamination Certificate

active

07994246

ABSTRACT:
A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for epoxy resin; and (C) an epoxy compound represented by the specific general formula; is characterized by excellent handleability and reduced oil-bleeding, and, when cured, forms a cured body of excellent flexibility and adhesion.

REFERENCES:
patent: 2007/0149727 (2007-06-01), Okuhira et al.
patent: 06056999 (1993-03-01), None
patent: 2005154766 (2005-06-01), None
patent: 2006306953 (2006-11-01), None
patent: 2006306954 (2006-11-01), None
patent: WO 2006118335 (2006-11-01), None
English language translation and abstract for JP 06-056999 extracted from PAJ database, dated Nov. 6, 2009, 71 pages.
English language translation and abstract for JP 2005-154766 extracted from PAJ database, dated Nov. 6, 2009, 55 pages.
English language translation and abstract for JP 2006-306953 extracted from PAJ database, dated Nov. 6, 2009, 55 pages.
English language translation and abstract for JP 2006-306954 extracted from PAJ database, dated Nov. 6, 2009, 78 pages.
PCT International Search Report for PCT/JP2007/074607, dated Mar. 28, 2008, 3 pages.

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