Pellicle for photolithography

Details Pellicle for photolithography Pellicle for photolithography

2011-03-08

2011-03-08

Rosasco, Stephen (Department: 1721)

Radiation imagery chemistry: process, composition, or product th

Radiation modifying product or process of making

Radiation mask

Reexamination Certificate

active

07901841

ABSTRACT:
In a photolithographic pellicle for dustproof protection of a photomask for photolithographic patterning by mounting thereon with the aid of a pressure-sensitive adhesive layer on one end surface of the pellicle frame, the adverse influence on the flatness of the photomask caused by mounting the pellicle can be minimized when the thickness of the pressure-sensitive adhesive layer is 0.4 mm or larger or when the elastic modulus of the layer does not exceed 0.5 MPa.

REFERENCES:
patent: 5470621 (1995-11-01), Kashida et al.
patent: 2006/0110664 (2006-05-01), Hamada
Fujita M et al., “Pellicle-Induced Distortions in Advanced Photomasks” Proceedings of The SPIE—The International Society for Optical Engineering Eng. USA, Jul. 2007, vol. 4754, pp. 589-596.
Cotte et al., Effects of Soft Pellicle Frame Curvature and Mounting Process on Pellicle Induced Distortions in Advanced Photomasks: Proceedings of the SPIE, SPIE Bellingham, VA U.S. vol. 5040 No. 1, Mar. 2003, pp. 1044-1054.
Wistrom R et al., “Influence of the Pellicle on Final Photomask Flatness” Proceedings of The SPIE—The International Society for Optical Engineering Eng. USA, vol. 6283, No. 1, May 2006, pp. 628326-1.

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