Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2011-05-17
2011-05-17
Semenenko, Yuriy (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S256000
Reexamination Certificate
active
07943858
ABSTRACT:
There is provided a thin film capacitor and a capacitor-embedded printed board improved in leakage current characteristics. A dielectric layer is formed of a BiZnNb-based amorphous metal oxide with a predetermined dielectric constant without being heat treated at a high temperature, and metallic phase bismuth of the BiZnNb-based amorphous metal oxide is adjusted in content to attain a desired dielectric constant. Also, another dielectric layer having a different content of metallic phase bismuth may be formed. The thin film capacitor including: a first electrode; a dielectric layer including a first dielectric film formed on the first electrode, the dielectric layer comprising a BiZnNb-based amorphous metal oxide; and a second electrode formed on the dielectric layer, wherein the BiZnNb-based amorphous metal oxide contains metallic phase bismuth.
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Chinese Office Action, with English translation, issued in Chinese Patent Application No. 200810088819.2, mailed Jul. 27, 2010.
Park, J.H., et al., “Bismuth-zinc-niobate embedded capacitors grown at room temperature for printed circuit board applications”, Applied Physics Letters, 2006, vol. 88 192902, American Institute of Physics.
Chung Yul Kyo
Lee In Hyung
Lee Jung Won
Lee Seung Eun
Song Byung Ik
McDermott Will & Emery LLP
Samsung Electro-Mechanics Co. Ltd.
Semenenko Yuriy
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