Treating multilayer printed wiring boards

Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156644, 29852, 29857, 174 685, C23C 1500

Patent

active

042305535

ABSTRACT:
Multilayer printed wiring boards are conventionally laminated using epoxy adhesives. When the boards are drilled, a residual smear often remains within the drilled holes. This smear prevents proper through plating of the holes and the layers are left without some of the intended interconnections. In the past, the residual smear was removed by wet etching. A technique is described using plasma etching with the conductive surface layers of the drilled boards as the electrodes to generate the plasma. The plasma forms directly within the holes and effectively removes the smear. A dielectric material in contact or close proximity to the perimeter of each board provides uniformity of treatment over the panels.

REFERENCES:
patent: 4012307 (1977-03-01), Phillips
J. L. Vossen, Glow Discharge Phenomena in Plasma Etching and Plasma Deposition, J. Electrochem. Soc., Feb. 1979, pp 319-324.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Treating multilayer printed wiring boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Treating multilayer printed wiring boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Treating multilayer printed wiring boards will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-266767

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.