Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-05-24
2011-05-24
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679480, C361S679520, C361S679540, C361S679550, C361S694000, C361S695000, C361S697000, C361S700000, C361S703000, C361S704000, C165S080200, C165S080300, C165S185000, C174S015200, C174S016100, C174S016300
Reexamination Certificate
active
07948750
ABSTRACT:
An electronic device includes a chassis, an electronic component, a heat sink having a base and a thermal module. The chassis includes a bottom plate and a side plate surrounding the bottom plate. A cutout is defined in the side plate. The electronic component is arranged on the bottom plate and faces the cutout of the side plate. The base of the heat sink is arranged on the electronic component, and the thermal module is arranged on the base of the heat sink. The thermal module is assembled onto the base by extending through the cutout and can be taken out of the chassis through the cutout. The thermal module and the heat sink together dissipate heat generated by the electronic component when the thermal module is inserted into the chassis.
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Cheng Nien-Tien
Chuang Ping-Yang
Hung Jui-Wen
Foxconn Technology Co., Ltd.
Gandhi Jayprakash N
Hoffberg Robert J
Niranjan Frank R.
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