Photonic power devices and methods of manufacturing the same

Details Photonic power devices and methods of manufacturing the same Photonic power devices and methods of manufacturing the same

2011-08-09

2011-08-09

Kim, Ellen (Department: 2874)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S088000, C385S093000, C385S094000

Reexamination Certificate

active

07993064

ABSTRACT:
A high temperature optoelectronic device package includes a substrate, an optoelectronic die situated on an upper surface of the substrate, a seal surrounding the optoelectronic die and situated on the upper surface of the substrate and a housing disposed on the seal having a ferrule-seating portion. The housing is disposed on the seal such that a fiber optic center of the ferrule-seating portion is aligned with an active portion of the optoelectronic die. The optoelectronic die is in operative communication with electronic traces of the substrate.

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CYOPTICS, “TO293BU-XYZ 1310nm DFB Laser Diode in TO-can package for use in Uncooled applications up to 2.7Gb/sec”, Data Sheet Jan. 2007, pp. 1-6, www.cyotics.com.

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