Electronic device and method of manufacturing same

Details Electronic device and method of manufacturing same Electronic device and method of manufacturing same

2011-06-21

2011-06-21

Thomas, Tom (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257SE21501, C438S124000

Reexamination Certificate

active

07964448

ABSTRACT:
This application relates to a method of manufacturing a semiconductor device comprising: providing a metal carrier; placing the metal carrier into a mold for forming a molded structure holding the metal carrier; segmenting the metal carrier into at least two disconnected metal carrier segments; and attaching a semiconductor chip to the molded structure.

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