Phase change memory element and method for forming the same

Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Bulk effect switching in amorphous material

Reexamination Certificate

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Details

C257SE31029, C257SE45001, C257SE21068, C438S095000, C438S238000

Reexamination Certificate

active

07868311

ABSTRACT:
A phase change memory and method for fabricating the same are provided. The phase change memory element includes: a substrate; rectangle-shaped dielectric patterns formed on the substrate and parallel with each other; electric conductive patterns partially covering a first sidewall and the top surface of the dielectric pattern and the substrate to expose the first sidewall and a second sidewall of the dielectric pattern, wherein the electric conductive patterns covering the same dielectric pattern are apart from each other; a phase change spacer formed on the substrate and directly in contact with the exposed first and second sidewalls of the dielectric patterns, wherein the two adjacent electric conductive patterns covering the same dielectric pattern are electrically connected by the phase change spacer; and a dielectric layer formed on the substrate.

REFERENCES:
patent: 7075131 (2006-07-01), Chen
patent: 7119353 (2006-10-01), Lankhorst et al.
patent: 7135727 (2006-11-01), Lee et al.
patent: 7655941 (2010-02-01), Lin et al.
patent: 2004/0248339 (2004-12-01), Lung
patent: 2008/0237565 (2008-10-01), Chang

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