Method and apparatus for fabricating semiconductor device

Details Method and apparatus for fabricating semiconductor device Method and apparatus for fabricating semiconductor device

1996-01-23

1998-09-01

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156584, 134 5, 134 32, 134 59, 1341043, 134902, 294263, 294265, B32B 3100

Patent

active

058006656

ABSTRACT:
A method of fabricating a semiconductor device includes preparing a semiconductor substrate having a surface and a mechanical strength; adhering a reinforcing plate to the surface of the semiconductor substrate with an adhesive to increase the mechanical strength of the semiconductor substrate and processing the semiconductor substrate; and immersing the semiconductor substrate with the reinforcing plate in a heated solvent to melt and dissolve the adhesive, thereby separating the semiconductor substrate from the reinforcing plate. An apparatus for performing the methods includes a holder for holding the semiconductor substrate with the reinforcing plate; a container for accommodating the holder and for containing a solvent that dissolves the adhesive and a heater for heating the solvent. When the adhesive between the semiconductor substrate and the reinforcing plate is sufficiently dissolved by the solvent, the semiconductor substrate is separated from the reinforcing plate. Therefore, no force is applied to the semiconductor substrate in the direction perpendicular to the surface of the semiconductor substrate, so that unwanted damage of the semiconductor substrate, such as cracking, is avoided.

REFERENCES:
patent: 4466852 (1984-08-01), Beltz et al.
patent: 4675067 (1987-06-01), Valley
patent: 4830699 (1989-05-01), Burlet et al.
patent: 5256599 (1993-10-01), Asetta et al.
patent: 5427644 (1995-06-01), Nagatsuka et al.

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