Circuit device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C257S713000, C361S704000

Reexamination Certificate

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07907390

ABSTRACT:
A circuit device includes a metal substrate; and a plurality of circuit elements, mounted on the metal substrate, which electrically connects to the metal substrate. The metal substrate is made of a copper plate of high thermal conductivity. The metal substrate is demarcated into a plurality of sections by insulating films added with a filler for enhancing the thermal conductivity in resin. The circuit elements, which have respective independent operating potentials on a side of the metal substrate of the circuit elements, are respectively provided on separated copper plates.

REFERENCES:
patent: 3965481 (1976-06-01), Esser
patent: 6953712 (2005-10-01), Usui et al.
patent: 7187060 (2007-03-01), Usui
patent: 7199496 (2007-04-01), Suzuki et al.
patent: 2004/0140551 (2004-07-01), Usui et al.
patent: 2004/0152234 (2004-08-01), Usui et al.
patent: 2005/0161682 (2005-07-01), Mazzochette et al.
patent: 2006/0032049 (2006-02-01), Usui et al.
patent: 11-074452 (1999-03-01), None

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