Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2011-05-24
2011-05-24
Pham, Hoai V (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S109000, C257SE21499
Reexamination Certificate
active
07947529
ABSTRACT:
Microelectronic die packages, stacked systems of die packages, and methods of manufacturing thereof are disclosed herein. In one embodiment, a method of manufacturing a microelectronic device includes stacking a first die package having a first dielectric casing on top of a second die package having a second dielectric casing, aligning first metal leads at a lateral surface of the first casing with second metal leads at a second lateral surface of the second casing, and forming metal solder connectors that couple individual first leads to individual second leads. In another embodiment, the method of manufacturing the microelectronic device may further include forming the connectors by applying metal solder to a portion of the first lateral surface, to a portion of the second lateral surface, and across a gap between the first die package and the second die package so that the connectors are formed by the metal solder wetting to the individual first leads and the individual second leads.
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Jeung Boon Suan
Koon Eng Meow
Poo Chia Yong
Yean Tay Wuu
Micro)n Technology, Inc.
Perkins Coie LLP
Pham Hoai v
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