Method of making a circuit assembly

Details Method of making a circuit assembly Method of making a circuit assembly

2011-04-19

2011-04-19

Banks, Derris H (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S831000, C029S835000, C029S846000, C029S852000

Reexamination Certificate

active

07926173

ABSTRACT:
An electronic assembly400and a method for its manufacture800, 900, 1000 1200, 1400, 1500, 1700. The assembly400uses no solder. Components406, or component packages402, 802, 804, 806with IPO leads412are placed800onto a planar substrate808. The assembly is encapsulated900with electrically insulating material908with vias420, 1002formed or drilled1000through the substrate808to the components' leads412. Then the assembly is plated1200and the encapsulation and drilling process1500repeated to build up desired layers422, 1502, 1702. The planar substrate808may be a flexible substrate2016allowing bending of an assembly2000to fit into various enclosures.

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