Semiconductor device and manufacturing method thereof

Details Semiconductor device and manufacturing method thereof Semiconductor device and manufacturing method thereof

Filed on

2011-04-19

Date issued

2011-04-19

Examiner

Potter, Roy K (Department: 2822)

Patent Class

Active solid-state devices (e.g., transistors, solid-state diode

SubClass

Housing or package

SubSubClass

With contact or lead

Other Related Categories

C257S737000, C257SE21509

Type

Reexamination Certificate

Status

active

Patent number

07928556

Description

ABSTRACT:
There is provided a low-cost semiconductor device that commercial and quality-assured (inspected) chip size packages can be stacked and has a small co-planarity value and a high mounting reliability. A semiconductor device in which a flexible circuit substrate is adhered to at least a part of a lateral side of a semiconductor package, and the flexible circuit substrate, which is on a side facing solder balls of the semiconductor package, is folded at a region inside of an edge of the semiconductor package.

REFERENCES:
patent: 6576992 (2003-06-01), Cady et al.
patent: 1997022976 (1997-01-01), None
patent: 1998112478 (1998-04-01), None
patent: 2002076263 (2002-03-01), None
patent: 2004146751 (2004-05-01), None
International Search Report for PCT/JP2008/066971 mailed Dec. 9, 2008.

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