Method and apparatus for correcting assist-feature-printing...

Details Method and apparatus for correcting assist-feature-printing... Method and apparatus for correcting assist-feature-printing...

2011-07-12

2011-07-12

Chiang, Jack (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Design of semiconductor mask or reticle

Reexamination Certificate

active

07979812

ABSTRACT:
One embodiment of the present invention provides a system that adjusts assist features in a layout to prevent assist features from printing. During operation, the system receives a layout. The system then identifies an assist-feature (AF)-printing hotspot in the layout, wherein the AF-printing hotspot includes a set of assist features and one or more target patterns in proximity to the set of assist features. At least one assist feature in the set of assist features is expected to print during a lithography process. Next, the system modifies the AF-printing hotspot by: (1) modifying the set of assist features; and (2) performing optical-proximity-correction (OPC) on the one or more target patterns. The system then performs a lithography simulation on the modified AF-printing hotspot to determine if: (1) a through-process-window associated with the modified AF-printing hotspot is acceptable; and (2) no assist feature in the modified set of assist features is expected to print. If so, the system replaces the AF-printing hotspot with the modified AF-printing hotspot.

REFERENCES:
patent: 2004/0209169 (2004-10-01), Cui et al.
patent: 2006/0236296 (2006-10-01), Melvin et al.
patent: 2009/0037852 (2009-02-01), Kobayashi et al.
patent: 2010/0099032 (2010-04-01), Zou et al.
patent: 2010/0122224 (2010-05-01), Lucas et al.
patent: 2010/0262946 (2010-10-01), Poonawala et al.

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