Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2011-06-07
2011-06-07
Chambliss, Alonzo (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S784000, C257SE23024, C257SE23105, C438S122000, C438S617000, C361S699000
Reexamination Certificate
active
07956458
ABSTRACT:
An integrated optical I/O and semiconductor chip with a direct liquid jet impingement cooling assembly are disclosed. Contrary to other solutions for packaging an optical I/O with a semiconductor die, this assembly makes use of a metal clad fiber, e.g. copper, which will actually enhance cooling performance rather than create a design restriction that has the potential to limit cooling capability.
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Campbell Levi A
DeCusatis Casimer M
Ellsworth, Jr. Michael J
Chambliss Alonzo
Chiu Steven
International Business Machines - Corporation
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