Semiconductor chips for TAG applications, devices for...

Registers – Records – Conductive

Reexamination Certificate

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C235S380000, C235S487000

Reexamination Certificate

active

07922093

ABSTRACT:
A TAG chip includes a magnetic coating or an electrostatically chargeable structure. A device for packing semiconductor chips includes an electromagnetic or electrostatic lifter, which picks up singulated semiconductor chips of a semiconductor wafer with a magnetic coating or including an electrostatically chargeable structure from a wafer position and deposits them in a collecting position. A mounting device includes a conveying roller with conveying receptacles for semiconductor chips, which pick up the semiconductor chips in a pick-up position with electromagnetically or electrostatically activatable conveying receptacles and, in a discharge position will discharge, via deactivation of the conveying receptacles, the semiconductor chips onto a corresponding liner or an object.

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patent: 2004/0038499 (2004-02-01), Kim et al.
patent: 2005/0001711 (2005-01-01), Doughty et al.
patent: 2006/0131712 (2006-06-01), Jerebic et al.
patent: 19743348 (1999-08-01), None
patent: 19946254 (2001-04-01), None
patent: 0905657 (1999-03-01), None
patent: 59011639 (1984-01-01), None
patent: 59215739 (1984-12-01), None
patent: 2004012896 (2004-02-01), None

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