Multilayered printed circuit board

Details Multilayered printed circuit board Multilayered printed circuit board

2011-04-19

2011-04-19

Dinh, Tuan T (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S780000, C361S782000, C361S794000, C361S795000

Reexamination Certificate

active

07929315

ABSTRACT:
A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to the first surface layer, a main power supply wiring layer, and a ground layer between the first and second surface layers. In the multilayered printed circuit board, one terminal of the bypass capacitor is connected to a midpoint of a wiring path from the main power supply wiring layer to a power supply terminal of the semiconductor integrated circuit, and an impedance of a first wiring path from the main power supply wiring layer to the terminal of the bypass capacitor is higher than an impedance of a second wiring path from the terminal of the bypass capacitor to the power supply terminal of the semiconductor integrated circuit.

REFERENCES:
patent: 5719750 (1998-02-01), Iwane
patent: 5912809 (1999-06-01), Steigerwald et al.
patent: 6084779 (2000-07-01), Fang
patent: 6166457 (2000-12-01), Iguchi et al.
patent: 6768650 (2004-07-01), Devey

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