Coating processes – Electrical product produced
Reexamination Certificate
2011-08-16
2011-08-16
Talbot, Brian K (Department: 1715)
Coating processes
Electrical product produced
C427S108000, C427S126200
Reexamination Certificate
active
07998525
ABSTRACT:
The present invention relates to a method of manufacturing an electrode substrate that has a base substrate made of glass having a strain point of 520° C. or higher, a transparent conductive layer formed on the base substrate, a metal wiring layer, and an insulating layer made of low-melting glass that covers the metal wiring layer, the metal wiring layer and the insulating layer being provided on the transparent conductive layer, the method including at least the steps of providing paste that forms a base material of the low-melting glass so as to cover the metal wiring layer; and forming the insulating layer by sintering the paste by means of a heat treatment.
REFERENCES:
patent: 5084365 (1992-01-01), Gratzel et al.
patent: 2002/0017864 (2002-02-01), Watanabe et al.
patent: 2006/0038228 (2006-02-01), Aitken et al.
patent: 2006/0162770 (2006-07-01), Matsui et al.
patent: 1236481 (1999-11-01), None
patent: 1703801 (2005-11-01), None
patent: 1703801 (2005-11-01), None
patent: 1-220380 (1989-09-01), None
patent: 2003-203681 (2003-07-01), None
patent: 2005-078857 (2005-03-01), None
patent: 2005078857 (2005-03-01), None
patent: 2005-103754 (2005-04-01), None
patent: 2005-290153 (2005-10-01), None
patent: 2006-107892 (2006-04-01), None
patent: 9820524 (1998-05-01), None
Graetzel, M. et al. Nature, United Kingdom, Oct. 24, 1991, vol. 353, pp. 737-740.
Fujikura Ltd.
Sughrue & Mion, PLLC
Talbot Brian K
LandOfFree
Method of manufacturing electrode substrate for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing electrode substrate for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing electrode substrate for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2647899