Metal fusion bonding – With control means responsive to sensed condition
Patent
2000-03-30
2000-12-19
Ryan, Patrick
Metal fusion bonding
With control means responsive to sensed condition
228 62, 228 33, B23K 100, B23K 3102
Patent
active
061617482
ABSTRACT:
The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.
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Fukuda Hiroshi
Iwata Yasuhiro
Katayama Kaoru
Kazui Shinichi
Ohta Toshihiko
Hitachi , Ltd.
Ryan Patrick
Stoner Kiley
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