Multi-layer flexible printed circuit board and method for...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S260000

Reexamination Certificate

active

07977577

ABSTRACT:
Disclosed are a multi-layer flexible printed circuit board and a method for manufacturing the same. The multi-layer flexible printed circuit board includes an adhesion sheet from which a pressing and heating area is cut, an upper base layer, from which the pressing and heating area is cut, on the adhesion sheet, and a lower base layer under to the adhesion sheet.

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