Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2011-07-12
2011-07-12
Semenenko, Yuriy (Department: 2835)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S260000
Reexamination Certificate
active
07977577
ABSTRACT:
Disclosed are a multi-layer flexible printed circuit board and a method for manufacturing the same. The multi-layer flexible printed circuit board includes an adhesion sheet from which a pressing and heating area is cut, an upper base layer, from which the pressing and heating area is cut, on the adhesion sheet, and a lower base layer under to the adhesion sheet.
REFERENCES:
patent: 5589251 (1996-12-01), Imaichi et al.
patent: 5603158 (1997-02-01), Murata et al.
patent: 6602584 (2003-08-01), Jo et al.
patent: 6620513 (2003-09-01), Yuyama et al.
patent: 6902949 (2005-06-01), Yamazaki et al.
patent: 2005/0104214 (2005-05-01), Maeda et al.
patent: 2009/0038839 (2009-02-01), Hashimoto et al.
patent: 2009/0095517 (2009-04-01), Nonaka et al.
patent: 2009/0178834 (2009-07-01), Akutsu et al.
patent: 2-039489 (1990-02-01), None
patent: 4-334088 (1992-11-01), None
patent: 8-104859 (1996-04-01), None
patent: 2002-314207 (2002-10-01), None
LG Innotek Co. Ltd.
Saliwanchik Lloyd & Eisenschenk
Semenenko Yuriy
LandOfFree
Multi-layer flexible printed circuit board and method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multi-layer flexible printed circuit board and method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer flexible printed circuit board and method for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2646897