Dynamic tracking of wafer motion and distortion during...

Details Dynamic tracking of wafer motion and distortion during... Dynamic tracking of wafer motion and distortion during...

2011-03-01

2011-03-01

Nguyen, Kiet T (Department: 2881)

Radiant energy

Irradiation of objects or material

Irradiation of semiconductor devices

C250S492220, C250S398000

Reexamination Certificate

active

07897942

ABSTRACT:
A substrate processing apparatus and method for dynamic tracking of wafer motion and distortion during lithography are disclosed. An energetic beam may be applied to a portion of a substrate according to a predetermined pattern. The relative positions of one or more targets on the substrate may be determined while applying the energetic beam to the portion of the substrate. A dynamic distortion of the substrate may be determined from the relative positions while applying the energetic beam to the portion of the substrate. Application of the energetic beam may be deviated from the predetermined pattern in a manner calculated to compensate for the dynamic distortion of the substrate.

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