Microresonator systems and methods of fabricating the same

Details Microresonator systems and methods of fabricating the same Microresonator systems and methods of fabricating the same

2011-07-05

2011-07-05

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

Reexamination Certificate

active

07972882

ABSTRACT:
Various embodiments of the present invention are related to microresonator systems and to methods for fabricating the microresonator systems. In one embodiment, a method of fabricating a microresonator system comprises: forming a multilayer system having a bottom layer, a top layer, and an intermediate layer having one or more quantum wells and sandwiched between the bottom layer and the top layer; embedding at least one waveguide in a substrate having a top surface, the at least one waveguide positioned adjacent to the top surface of the substrate; wafer bonding the top layer of the multilayer system to the top surface of the substrate; forming a microresonator in the multilayer system, wherein at least a portion of a peripheral annular region of the microresonator is portioned above the at least one waveguide; and forming a current isolation region in at least a portion of a central region of the microresonator.

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Hewlett-Packard Development Company, L.P.. “Microresonator Systems and Methods of Fabricating the Same”, PCT International Search Report (ISA/KR), Feb. 23, 2009.

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