Molding apparatus

Details Molding apparatus Molding apparatus

2011-03-29

2011-03-29

Del Sole, Joseph S (Department: 1743)

Plastic article or earthenware shaping or treating: apparatus

With apparatus assembly or dismantling means or with idle part

For extrusion or injection type shaping means

C425S195000, C425S400000, C425S412000, C425S468000, C425S808000, C249S063000, C249S139000

Reexamination Certificate

active

07914274

ABSTRACT:
A molding apparatus includes a first mold half, a first mold core received in the first mold half, a second mold half opposite to the first mold half, a second mold core and a plurality of spacers. The second mold core includes a sleeve and a core insert. The sleeve is received in the second mold core. The sleeve includes a receiving hole defined therein, and a plurality of parallel grooves defined in an inner surface in the receiving hole. The grooves are angularly equidistantly spaced from each other. The core insert is received in the receiving hole of the sleeve. The plurality of spacers is configured for being selectively disposed in the corresponding grooves. Each of the spacers is configured for being sandwiched between the sleeve and the core insert.

REFERENCES:
patent: 6739569 (2004-05-01), Bickert
patent: 6997693 (2006-02-01), Horner et al.
patent: 7134864 (2006-11-01), Yang et al.
patent: 7699298 (2010-04-01), Shen et al.
patent: 2007/0243277 (2007-10-01), Tsai
patent: 2009/0117221 (2009-05-01), Tsai et al.
patent: 2009/0191299 (2009-07-01), Huang
patent: 2009/0194667 (2009-08-01), Huang
patent: 42 17 343 (1993-12-01), None
patent: 61-120711 (1986-06-01), None
patent: WO 88/00559 (1988-01-01), None

Affiliated with

Also associated with

Rating

Molding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molding apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2644002