Surface mountable hermetically sealed package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

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Details

C257S693000, C257S703000, C257S704000, C257SE21499, C257SE23193

Reexamination Certificate

active

07948069

ABSTRACT:
A high reliability package which includes electrical terminals formed from an alloy of tungsten copper and brazed onto a surface of a ceramic substrate.

REFERENCES:
patent: 5814883 (1998-09-01), Sawai et al.
patent: 5821617 (1998-10-01), Autry et al.
patent: 5939772 (1999-08-01), Hurst et al.
patent: 6111199 (2000-08-01), Wyland et al.
patent: 6198166 (2001-03-01), Coronati
patent: 6285067 (2001-09-01), Hyoudo et al.
patent: 6329065 (2001-12-01), Ishida et al.
patent: 6459149 (2002-10-01), Shimoe et al.
patent: 6621162 (2003-09-01), Ishida et al.
patent: 6713857 (2004-03-01), Tsai
patent: 6778029 (2004-08-01), Mizusawa
patent: 6921971 (2005-07-01), Basho et al.
patent: 6984076 (2006-01-01), Walker et al.
patent: 2002/0011352 (2002-01-01), Yoshisato et al.
patent: 2002/0060356 (2002-05-01), Nishibori et al.
patent: 2003/0013234 (2003-01-01), Bregante et al.
patent: 2003/0183920 (2003-10-01), Goodrich et al.
patent: 0 544 915 (1993-06-01), None
patent: 1 050 906 (2000-11-01), None

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