Overmolded electronic module with an integrated...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S832000

Reexamination Certificate

active

07958629

ABSTRACT:
A method for making an electronic module with an integrated electromagnetic shield uses surface mount shield wall components. At least one electronic component and two or more of the shield wall components are mounted on a surface of a circuit board panel using a pick-and-place process. Each shield wall component has a conductive portion and a non-conductive portion mounted in contact with the surface of the circuit board panel. The mounted shield wall components form a conductive wall to electromagnetically shield the electronic component. The non-conductive portion of one or more of the mounted shield wall components is sawn through, leaving some or all of the conductive portion of the mounted shield wall components. A top conductive shield can be applied. The non-conductive portions can provide stability during a reflow soldering process, while the sacrificial non-conductive portions are sawn through so that they can be removed to reduce the amount of area occupied by the overmoldable shield structure.

REFERENCES:
patent: 3816911 (1974-06-01), Knappenberger
patent: 4151637 (1979-05-01), Zemek et al.
patent: 4241497 (1980-12-01), Du Bois
patent: 4245385 (1981-01-01), Zemek et al.
patent: 4447945 (1984-05-01), Priscsak
patent: 4724613 (1988-02-01), Dale
patent: 4857483 (1989-08-01), Steffen et al.
patent: 5428508 (1995-06-01), Pronto
patent: 5940964 (1999-08-01), Mugiya
patent: 6192577 (2001-02-01), Larsson
patent: 6202294 (2001-03-01), Bogannam
patent: 6449828 (2002-09-01), Pahl et al.
patent: 6947295 (2005-09-01), Hsieh
patent: 6994901 (2006-02-01), Chen et al.
patent: 2001/0013165 (2001-08-01), Hansen et al.
patent: 2002/0083570 (2002-07-01), Inoue et al.
patent: 2007/0071886 (2007-03-01), Babb et al.

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