Electromagnetic bandgap structure and printed circuit board

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S321200, C361S748000, C361S794000, C174S255000, C174S256000, C174S260000, C174S262000, C257S533000, C257S621000, C257S664000, C257S665000, C343S909000

Reexamination Certificate

active

07965521

ABSTRACT:
An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size.

REFERENCES:
patent: 6353540 (2002-03-01), Akiba et al.
patent: 7298234 (2007-11-01), Dutta
patent: 2002/0180004 (2002-12-01), Oggioni et al.
patent: 2005/0029632 (2005-02-01), McKinzie et al.
patent: 7-263908 (1995-10-01), None
patent: 2002-171107 (2002-06-01), None
patent: 2003-133801 (2003-05-01), None
patent: 2006-261651 (2008-09-01), None
Japanese Office Action issued May 18, 2010 in corresponding Japanese Patent Application 2008-043333.
Taiwanese Office Action dated Oct. 21, 2010, issued in corresponding Taiwanese Patent Application No. 097100737.

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