Semiconductor package with position member

Details Semiconductor package with position member Semiconductor package with position member

2011-04-05

2011-04-05

Mandala, Victor (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S124000, C438S127000, C257SE21504, C257SE21506

Reexamination Certificate

active

07919361

ABSTRACT:
The present disclosure provides a very thin semiconductor package including a leadframe with a die-attach pad and a plurality of lead terminals, a die attached to the die-attach pad and electrically connected to the lead terminals via bonding wires, a position member disposed upon the die and/or die-attach pad, and a molding material encapsulating the leadframe, the die, and the position member together to form the semiconductor package. The method for manufacturing a very thin semiconductor package includes disposing a first position member on one side of the die-attach pad of a leadframe, attaching a die onto the opposite side of the die-attach pad, optionally disposing a second position member on top of the die, electrically connecting the die to the lead terminals of the leadframe, and encapsulating the leadframe, the die, and the position member(s) together to form the very thin semiconductor package.

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Australian Patent Office Search Report dated Feb. 6, 2009 in connection with Australian Patent Application No. SG 200506718-06.
Australian Patent Office Written Opinion dated Feb. 6, 2009 in connection with Australian Patent Application No. SG 200506718-06.

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