Microelectronic assemblies having compliancy

Details Microelectronic assemblies having compliancy Microelectronic assemblies having compliancy

2011-08-16

2011-08-16

Hoang, Quoc D (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S779000

Reexamination Certificate

active

07999379

ABSTRACT:
A microelectronic assembly includes a microelectronic element, such as a semiconductor wafer or semiconductor chip, having a first surface and contacts accessible at the first surface, and a compliant layer overlying the first surface of the microelectronic element, the compliant layer having openings in substantial alignment with the contacts of the microelectronic element. The assembly desirably includes conductive posts overlying the compliant layer and projecting away from the first surface of the microelectronic element, the conductive posts being electrically interconnected with the contacts of the microelectronic element by elongated, electrically conductive elements extending between the contacts and the conductive posts.

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