Thermal measuring and testing – Temperature measurement – By electrical or magnetic heat sensor
Reexamination Certificate
2011-05-24
2011-05-24
Verbitsky, Gail (Department: 2855)
Thermal measuring and testing
Temperature measurement
By electrical or magnetic heat sensor
C374S137000, C338S0220SD, C702S130000, C257S457000
Reexamination Certificate
active
07946763
ABSTRACT:
A compact resistive thermal sensor is provided for an integrated circuit (IC), wherein different sensor components are placed on different layers of the IC. This allows the lateral area needed for the sensor resistance wire on any particular IC layer to be selectively reduced. In a useful embodiment, a plurality of first linear conductive members are positioned in a first IC layer, in spaced-apart parallel relationship with one another. A plurality of second linear conductive members are similarly positioned in a second IC layer in spaced-apart parallel relationship with one another, and in orthogonal relationship with the first linear members or in parallel with existing wiring channels of the second IC layer. Conductive elements respectively connect the first linear members into a first conductive path, and the second linear members into a second conductive path. A third conductive element extending between the first and second layers connects the first and second conductive paths into a single continuous conductive path, wherein the path has a resistance that varies with temperature. A device responsive to an electric current sent through the continuous path determines temperature of the path from the path resistance. Two or more of the thermal sensors could be connected in series, for use in measuring critical IC circuits.
REFERENCES:
patent: 4869598 (1989-09-01), McDonald
patent: 5475264 (1995-12-01), Sudo et al.
patent: 5602392 (1997-02-01), Owen et al.
patent: 5792377 (1998-08-01), Belcher et al.
patent: 5939789 (1999-08-01), Kawai et al.
patent: 6190040 (2001-02-01), Renken et al.
patent: 6238085 (2001-05-01), Higashi et al.
patent: 6403463 (2002-06-01), Suyama
patent: 6431750 (2002-08-01), Haberbusch et al.
patent: 6534868 (2003-03-01), Sekiguchi
patent: 6668230 (2003-12-01), Mansky et al.
patent: 6841843 (2005-01-01), Ohkubo et al.
patent: 6919226 (2005-07-01), Ogawa et al.
patent: 7122830 (2006-10-01), Ishikawa et al.
patent: 7188412 (2007-03-01), Yazaki et al.
patent: 7193311 (2007-03-01), Ogawa et al.
patent: 7253091 (2007-08-01), Brewer et al.
patent: 7510323 (2009-03-01), Rahman et al.
patent: 2002/0096768 (2002-07-01), Joshi
patent: 2003/0234449 (2003-12-01), Aratani et al.
patent: 2004/0094840 (2004-05-01), Sakamoto et al.
patent: 2004/0188795 (2004-09-01), Ohkubo et al.
patent: 2005/0161822 (2005-07-01), Ohkubo et al.
patent: 2005/0167842 (2005-08-01), Nakamura et al.
patent: 2005/0173775 (2005-08-01), Kawahara et al.
patent: 2005/0186768 (2005-08-01), Sugaya et al.
patent: 2005/0238080 (2005-10-01), Wolkin et al.
patent: 2006/0043595 (2006-03-01), Aratani et al.
patent: 2006/0145347 (2006-07-01), Aida
patent: 2006/0220227 (2006-10-01), Marro
patent: 2007/0145362 (2007-06-01), Wolkin et al.
patent: 2007/0187717 (2007-08-01), Sadaka et al.
patent: 2008/0002755 (2008-01-01), Raravikar et al.
patent: 2008/0088033 (2008-04-01), Humpston et al.
patent: 2008/0169514 (2008-07-01), Hsueh et al.
patent: 2009/0174520 (2009-07-01), Wada et al.
patent: 2010/0206624 (2010-08-01), Feichtinger
patent: 2376565 (1999-04-01), None
patent: 61216465 (1986-09-01), None
patent: 20040304070 (2004-09-01), None
Rahman Aquilur
Walls Lloyd Andre
Gerhardt Diana R.
International Business Machines - Corporation
Verbitsky Gail
Yee & Associates P.C.
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