Method of making printed circuit board assembly

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29843, 174267, 228179, 2281801, H01R 914

Patent

active

050920359

ABSTRACT:
A first set of plated-through holes in the printed circuit board (PCB) are covered by a protective solder mask on the solder side of the PCB while a second set of plated-through holes are exposed. Electrical components are disposed on the component side with leads inserted in the second set of holes. Solder is prevented from flowing into the first set of holes during wave soldering by the mask covering. Conductive pins designed for press fitting into the first set of holes are inserted therethrough to define connecting pins on each side of the PCB following wave soldering. This permits both a wave soldering and press fit operation to be accommodated.

REFERENCES:
patent: 3535769 (1970-10-01), Goldschmied
patent: 3834015 (1974-09-01), DiRenzo
patent: 3932934 (1976-01-01), Lynch et al.
patent: 4216576 (1980-08-01), Ammon et al.
patent: 4551914 (1985-11-01), Stiggelbout
patent: 4641426 (1987-02-01), Hartman et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of making printed circuit board assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making printed circuit board assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making printed circuit board assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-263429

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.