Manufacturing method for a multilayer printed circuit board

Details Manufacturing method for a multilayer printed circuit board Manufacturing method for a multilayer printed circuit board

1991-05-15

1992-03-03

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 29847, H05K 336

Patent

active

050920324

ABSTRACT:
Disclosed is a method for manufacturing a multilayer circuit board in which landless inter-layer connection is made between a lower-layer electric circuit and an upper-layer electric circuit formed on a substrate. The method of the invention utilizes a single photoresist to form a circuitization layer and the conductive via extending upwardly from it. In the method of the invention a metal layer is applied to the substrate, and photoresist is applied to the metal layer. The photoresist is then exposed and developed to define a resist hole. A via bump is formed in the resist hole. The residual resist is then imaged to form a first circuit pattern in the underlying metal layer. The remaining photoresist is removed from the first metal layer, and an organic dielectric layer is formed on the etched metal layer, the exposed substrate, and via bump. The organic dielectric layer is then flattened or otherwise processed to expose the surface of the via bump. Either a second metal layer or an electronic part is deposited or applied to the exposed top surface of the via bump as an upper-layer electric circuit element.

REFERENCES:
patent: 3769108 (1973-10-01), Feldman et al.
patent: 4763403 (1988-08-01), Klein et al.

Affiliated with

Also associated with

Rating

Manufacturing method for a multilayer printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing method for a multilayer printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method for a multilayer printed circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-263414