Semiconductor device with sealed semiconductor chip

Details Semiconductor device with sealed semiconductor chip Semiconductor device with sealed semiconductor chip

2011-04-05

2011-04-05

Gurley, Lynne A (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C257S678000, C257S687000, C257S690000, C257S692000, C257S784000, C257S787000, C257SE23015, C257SE23022, C257SE23024, C438S106000, C438S111000, C438S112000, C438S123000, C438S127000

Reexamination Certificate

active

07919837

ABSTRACT:
A semiconductor device includes a semiconductor chip with bonding pads, the bonding pads being arranged along one side of an element forming surface of the semiconductor chip, a lead frame including first and second internal leads arranged such that tips thereof correspond to some of the bonding pads of the semiconductor chip, and first and second bonding wires by which the first internal leads and the some of the bonding pads are bonded to each other. The semiconductor device further includes a hanging pin section provided on the element non-forming surface of the semiconductor chip, and a sealing member with which the semiconductor chip is sealed including the hanging pin section and a bonding section between the first and second internal leads and the first and second bonding wires.

REFERENCES:
patent: 5907769 (1999-05-01), Corisis
patent: 6184574 (2001-02-01), Bissey
patent: 2003/0107121 (2003-06-01), Roohparvar
patent: 2005/0236698 (2005-10-01), Ozawa et al.
patent: 2007/0001272 (2007-01-01), Lee et al.
patent: 2001-102515 (2001-04-01), None
patent: 2001-217383 (2001-08-01), None
patent: 2002-0065326 (2002-08-01), None

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