Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

Filed on

2011-05-17

Date issued

2011-05-17

Examiner

Chu, Chris (Department: 2815)

Patent Class

Active solid-state devices (e.g., transistors, solid-state diode

SubClass

Responsive to non-electrical signal

SubSubClass

Electromagnetic or particle radiation

Other Related Categories

C257SE31119, C257S081000, C257S098000, C257S737000, C438S113000, C250S239000

Type

Reexamination Certificate

Status

active

Patent number

07944015

Description

ABSTRACT:
The invention provides a semiconductor device having high reliability and a method of manufacturing the same. The semiconductor device of the invention has pad electrodes formed on a semiconductor die near the side surface portion thereof and connected to a semiconductor integrated circuit or the like in the semiconductor die, a supporting body formed on the pad electrodes, an insulation film formed on the side and back surface portions of the semiconductor die, wiring layers connected to the back surfaces of the pad electrodes and extending from the side surface portion onto the back surface portion of the semiconductor die so as to contact the insulation film, and a second protection film formed on the side surface portion of the supporting body.

REFERENCES:
patent: 4242695 (1980-12-01), Ouchi et al.
patent: 5656816 (1997-08-01), Tanaka
patent: 5804827 (1998-09-01), Akagawa et al.
patent: 5929440 (1999-07-01), Fisher
patent: 5973337 (1999-10-01), Knapp et al.
patent: 6165814 (2000-12-01), Wark et al.
patent: 6228676 (2001-05-01), Glenn et al.
patent: 6229223 (2001-05-01), Watanabe
patent: 6326689 (2001-12-01), Thomas
patent: 6372351 (2002-04-01), Takemiya et al.
patent: 6384459 (2002-05-01), Matsuda
patent: 6455774 (2002-09-01), Webster
patent: 6465786 (2002-10-01), Rhodes
patent: 6552344 (2003-04-01), Sone et al.
patent: 6563192 (2003-05-01), Corisis et al.
patent: 6646289 (2003-11-01), Badehi
patent: 6693337 (2004-02-01), Yoneda et al.
patent: 6717147 (2004-04-01), Oda
patent: 6838748 (2005-01-01), Ishio et al.
patent: 7102238 (2006-09-01), Noma et al.
patent: 7183589 (2007-02-01), Kameyama et al.
patent: 7274101 (2007-09-01), Tomita et al.
patent: 7332783 (2008-02-01), Misawa
patent: 7332789 (2008-02-01), Violette
patent: 7374971 (2008-05-01), Yuan et al.
patent: 7374972 (2008-05-01), Kwon et al.
patent: 7413931 (2008-08-01), Noma et al.
patent: 7569409 (2009-08-01), Lin et al.
patent: 7576361 (2009-08-01), Agranov et al.
patent: 7759779 (2010-07-01), Okada et al.
patent: 7781250 (2010-08-01), Wang et al.
patent: 2001/0050408 (2001-12-01), Bernstein et al.
patent: 2002/0019069 (2002-02-01), Wada
patent: 2003/0160185 (2003-08-01), Homme
patent: 2003/0230805 (2003-12-01), Noma et al.
patent: 2004/0016983 (2004-01-01), Misawa
patent: 2004/0076797 (2004-04-01), Zilber et al.
patent: 2004/0108588 (2004-06-01), Gilleo
patent: 2004/0130640 (2004-07-01), Fujimori
patent: 2004/0161920 (2004-08-01), Noma
patent: 2004/0183152 (2004-09-01), Yoneda et al.
patent: 2004/0187916 (2004-09-01), Hezel
patent: 2004/0188699 (2004-09-01), Kameyama et al.
patent: 2005/0009238 (2005-01-01), Okigawa
patent: 2005/0048740 (2005-03-01), Noma et al.
patent: 2005/0077458 (2005-04-01), Ma et al.
patent: 2005/0258447 (2005-11-01), Oi et al.
patent: 2006/0079019 (2006-04-01), Kim
patent: 2007/0145420 (2007-06-01), Okada et al.
patent: 2007/0145590 (2007-06-01), Noma et al.
patent: 2007/0210437 (2007-09-01), Noma et al.
patent: 2008/0258258 (2008-10-01), Horikoshi et al.
patent: 2008/0277793 (2008-11-01), Noma et al.
patent: 2010/0038668 (2010-02-01), Noma
patent: 2010/0164086 (2010-07-01), Noma et al.
patent: 5-21698 (1993-01-01), None
patent: 9-321333 (1997-12-01), None
patent: 2000-349238 (2000-12-01), None
patent: 2001-085652 (2001-03-01), None
patent: 2004-55674 (2004-02-01), None
patent: 2006-93367 (2006-04-01), None
patent: 10-2002-0048716 (2002-06-01), None
patent: 10-2004-0077472 (2004-09-01), None
patent: 10-2004-0092435 (2004-11-01), None
patent: 10-2005-0016041 (2005-02-01), None
patent: WO 99/40624 (1999-08-01), None
patent: WO-2005/004195 (2005-01-01), None
Okada, K. et al., U.S. Office Action, mailed Jan. 7, 2010, directed to related U.S. Appl. No. 11/639,410; 12 pages.
Horikoshi, K. et al., U.S. Office Action mailed Jul. 23, 2010, directed to U.S. Appl. No. 12/103,857; 10 pages.
Okada, K. et al., U.S. Office Action mailed Aug. 4, 2010, directed to U.S. Appl. No. 11/639,410; 14 pages.
Horikoshi, K. et al., U.S. Office Action, mailed Apr. 13, 2010, directed to a related U.S. Appl. No. 12/103,857; 12 pages.
Horikoshi, K. et al., U.S. Office Action mailed on Sep. 21, 2009, directed to a related U.S. Appl. No. 12/103,857; 13 pages.
Horikoshi, K. U.S Office Action, mailed Feb. 19, 2009, directed to a related U.S. Appl. No. 12/103,857; 8 pages.
Noma, T. et al., U.S. Office Action, mailed Mar. 11, 2009, directed to a related U.S. Appl. No. 11/639,411; 11 pages.
Okada, K. et al., U.S. Office Action, mailed Jan. 3, 2008, directed to a related U.S. Appl. No. 11/639,410; 11 pages.
Okada, K. et al., U.S. Office Action, mailed Jun. 25, 2008, directed to a related U.S. Appl. No. 11/639,410; 13 pages.
Okada, K. et al., U.S. Office Action, mailed Dec. 30, 2008, directed to a related U.S. Appl. No. 11/639,410; 15 pages.
European Search Report, mailed Jun. 10, 2009, directed to European Patent Application No. 06026027.0; 6 pages.
European Search Report, mailed Jun. 10, 2009, directed to European Patent Application No. 06026088.2; 5 pages.
Okada, K. et al., U.S. Office Action, mailed Jul. 22, 2009, directed to related U.S. Appl. No. 11/639,410; 16 pages.
Horikoshi, K. et al., U.S. Office Action, mailed Oct. 19, 2010, directed to a related U.S. Appl. No. 12/103,857; 9 pages.
Okada, K. et al., U.S. Office Action mailed Jan. 7, 2011, directed to U.S. Appl. No. 11/639,410; 17 pages.

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