Heat pipe with hydrophilic layer and/or protective layer

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

Reexamination Certificate

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Details

C165S104210

Reexamination Certificate

active

07874347

ABSTRACT:
A heat pipe (1) includes a shell (20), a protective layer (10) formed on an outer surface of the shell, a wick (30) and a hydrophilic layer (40) sequentially formed on an inner surface of the shell, and a working fluid contained in the shell. A material of the shell is metal, such as copper, aluminum, or a copper-aluminum alloy. The protective layer is formed of nanomaterials, such as carbon nanotubes, nano-sized copper particles, nano-sized aluminum particles, or nano-sized particles of a copper-aluminum alloy. The wick is made from a mixture of carbon fibers and carbon nanocapsules. The hydrophilic layer is made from nanomaterials, for example, titanium dioxide, zinc oxide, alumina, or any mixture thereof.

REFERENCES:
patent: 3587725 (1971-06-01), Basiulis
patent: 3750745 (1973-08-01), Moore, Jr.
patent: 3754594 (1973-08-01), Ferrell
patent: 3786861 (1974-01-01), Eggers
patent: 3875926 (1975-04-01), Frank
patent: 4042012 (1977-08-01), Perry et al.
patent: 4142576 (1979-03-01), Perry et al.
patent: 4274479 (1981-06-01), Eastman
patent: 4883116 (1989-11-01), Seidenberg et al.
patent: 5720339 (1998-02-01), Glass et al.
patent: 6446706 (2002-09-01), Rosenfeld et al.
patent: 6648063 (2003-11-01), Andraka et al.
patent: 6695974 (2004-02-01), Withers et al.
patent: 6766817 (2004-07-01), da Silva
patent: 6868898 (2005-03-01), Chau et al.
patent: 6889755 (2005-05-01), Zuo et al.
patent: 6936233 (2005-08-01), Smalley et al.
patent: 7124810 (2006-10-01), Lee et al.
patent: 7210519 (2007-05-01), Chen
patent: 7213637 (2007-05-01), Lin et al.
patent: 7410597 (2008-08-01), Chen
patent: 7579077 (2009-08-01), Dubrow et al.
patent: 7694726 (2010-04-01), Chen
patent: 7732918 (2010-06-01), Dangelo et al.
patent: 2001/0054495 (2001-12-01), Yevin et al.
patent: 2002/0124995 (2002-09-01), Moon et al.
patent: 2002/0139245 (2002-10-01), Kesten et al.
patent: 2003/0141045 (2003-07-01), Oh et al.
patent: 2005/0011572 (2005-01-01), Belcher
patent: 2005/0056808 (2005-03-01), Leu et al.
patent: 2005/0092467 (2005-05-01), Lin et al.
patent: 2005/0126766 (2005-06-01), Lee et al.
patent: 2005/0238810 (2005-10-01), Scaringe et al.
patent: 2006/0016580 (2006-01-01), Lee et al.
patent: 2006/0151153 (2006-07-01), Chen
patent: 2006/0159916 (2006-07-01), Dubrow et al.
patent: 2007/0235682 (2007-10-01), Chen
patent: 2008/0019098 (2008-01-01), Sung
patent: 2008/0128116 (2008-06-01), Dangelo et al.
patent: 2522409 (2002-11-01), None
patent: 2003042674 (2003-02-01), None

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