Heat dissipation device having a back plate unit

Details Heat dissipation device having a back plate unit Heat dissipation device having a back plate unit

2011-03-08

2011-03-08

Pape, Zachary M (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S697000, C361S709000, C257S718000, C257S719000, C257S722000, C165S080200, C165S080300, C165S185000, C174S016300, C174S252000, C024S458000, C024S459000, C024S520000

Reexamination Certificate

active

07903419

ABSTRACT:
A heat dissipation device for dissipating heat from an electronic component (12) mounted on a printed circuit board (10) includes a retention module (30) resting on the printed circuit board, a heat sink (20) disposed on the retention module for contacting the electronic component, a clip (40) for securing the heat sink to the retention module, and a back plate unit mounted below the printed circuit board for engaging with the retention module and supporting the electronic component. The back plate unit includes a back plate (50), a gasket (62) engaging with the back plate, and a bracket (64) being sandwiched between the gasket and the back plate. The gasket has an annular top face contacting the printed circuit board, and a plurality of blocks (6202) contacting the back plate, whereby the gasket can provide a sufficient and uniform support to the electronic component.

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