Heat exchange – Heat transmitter
Reexamination Certificate
2011-06-28
2011-06-28
Duong, Tho v (Department: 3744)
Heat exchange
Heat transmitter
C165S136000
Reexamination Certificate
active
07967062
ABSTRACT:
A composite interface and methods of fabrication are provided for coupling a cooling assembly to an electronic device. The interface includes a plurality of thermally conductive wires formed of a first material having a first thermal conductivity, and a thermal interface material at least partially surrounding the wires. The interface material, which thermally interfaces the cooling assembly to a surface to be cooled of the electronic device, is a second material having a second thermal conductivity, wherein the first thermal conductivity is greater than the second thermal conductivity. At least some wires reside partially over a first region of higher heat flux and extend partially over a second region of lower heat flux, wherein the first and second regions are different regions of the surface to be cooled. These wires function as thermal spreaders facilitating heat transfer from the surface to be cooled to the cooling assembly.
REFERENCES:
patent: 4295151 (1981-10-01), Nyul et al.
patent: 4546405 (1985-10-01), Hultmark et al.
patent: 5557501 (1996-09-01), DiStefano et al.
patent: 5783862 (1998-07-01), Deeney
patent: 5852871 (1998-12-01), Khandros
patent: 5989936 (1999-11-01), Smith et al.
patent: 6037658 (2000-03-01), Brodsky et al.
patent: 6236098 (2001-05-01), Efland et al.
patent: 6292367 (2001-09-01), Sikka et al.
patent: 6396700 (2002-05-01), Chu et al.
patent: 6542371 (2003-04-01), Webb
patent: 6766817 (2004-07-01), da Silva
patent: 6807059 (2004-10-01), Dale
patent: 6828668 (2004-12-01), Smith et al.
patent: 6836962 (2005-01-01), Khandros et al.
patent: 6918404 (2005-07-01), Dias da Silva
patent: 7066586 (2006-06-01), da Silva
patent: 2002/0015288 (2002-02-01), Dibene et al.
patent: 2005/0284926 (2005-12-01), Ishikawa
patent: 2005/0286234 (2005-12-01), Campbell et al.
Campbell Levi A.
Chu Richard C.
Ellsworth, Jr. Michael J.
Fogel Keith E.
Iyengar Madhusudan K.
Duong Tho V
Heslin Rothenberg Farley & & Mesiti P.C.
International Business Machines - Corporation
Jung, Esq. Dennis
Radigan, Esq. Kevin P.
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