Method of manufacturing wiring board having a semiconductor...

Details Method of manufacturing wiring board having a semiconductor... Method of manufacturing wiring board having a semiconductor...

2011-02-08

2011-02-08

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S840000, C029S846000, C029S852000, C257S698000, C438S698000

Reexamination Certificate

active

07882626

ABSTRACT:
A method of manufacturing a wiring board having a semiconductor chip mounting surface for mounting a semiconductor chip thereon which is manufactured by a process including a step of forming a wiring layer and an insulating layer on a support board and a step of removing the support board, including a peeling layer forming step of forming a peeling layer on the support board formed by a material having a coefficient of thermal expansion which is equal to that of a semiconductor substrate constituting the semiconductor chip, and a support board removing step of removing the support board by carrying out a predetermined treatment over the peeling layer.

REFERENCES:
patent: 6796024 (2004-09-01), Katoh et al.
patent: 2004/0154163 (2004-08-01), Miyazaki et al.
patent: 2004/0231141 (2004-11-01), Nishinaka et al.
patent: 2008/0245549 (2008-10-01), Kodani et al.
patent: 2009/0314525 (2009-12-01), Kajino et al.
patent: 2000-323613 (2000-11-01), None

Affiliated with

Also associated with

Rating

Method of manufacturing wiring board having a semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing wiring board having a semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing wiring board having a semiconductor... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2620770