Wireless IC device

Details Wireless IC device Wireless IC device

2011-08-30

2011-08-30

Lee, Seung (Department: 2887)

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Conductive

Reexamination Certificate

active

08006910

ABSTRACT:
An article package formed from, for example, an aluminum-evaporated laminated film includes a cut-out section, which has no aluminum-evaporated layer, in an edge. An electromagnetic-coupling module is disposed in the cut-out section. A wireless IC device is constituted by the electromagnetic-coupling module and an aluminum-evaporated layer of the package. A magnetic-field antenna of the electromagnetic-coupling module is coupled to the aluminum-evaporated layer of the package. The whole of the article package acts as a radiator of the antenna.

REFERENCES:
patent: 7036741 (2006-05-01), Usami et al.
patent: 2007/0182566 (2007-08-01), Kim et al.
Kato; “Wireless IC Device”; U.S. Appl. No. 12/339,198, filed Dec. 19, 2008.
Kato; “Wireless IC Device”; U.S. Appl. No. 11/964,185, filed Dec. 26, 2007.

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