Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-05-03
2011-05-03
Booth, Richard A. (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C438S127000
Reexamination Certificate
active
07936061
ABSTRACT:
A semiconductor device includes: a first insulating layer having an opening therethrough; a first wiring pattern disposed on the first insulating layer; an external connection terminal provided on a portion of the first wiring pattern exposed from the opening; a second insulating layer which covers the first wiring pattern and having via holes therethrough; a second wiring pattern disposed within the second insulating layer and electrically connected to the first wiring pattern via a conductive material filled in at least one of the via holes; a semiconductor element having an electrode thereon and mounted on the second insulating layer to be electrically connected to the first wiring pattern through the electrode disposed in at least one of the via holes; an underfill resin filled between the semiconductor element and the second insulating layer; and a sealing resin portion which seals the semiconductor element.
REFERENCES:
patent: 7239021 (2007-07-01), Arai et al.
patent: 9-097860 (1997-04-01), None
patent: 2003-152001 (2003-05-01), None
Booth Richard A.
Rankin , Hill & Clark LLP
Shinko Electric Industries Co. Ltd.
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